| NCID | BA20748989 |
| タイトル | Materials in microelectronic and optoelectronic packaging / edited by Hung C. Ling, Koichi Niwa, Vishwa N. Shukla |
| 出版者 | Westerville, Ohio : American Ceramic Society , c1993 |
| 形態 | viii, 471 p. : ill. ; 24 cm |
| 注記 | "Proceedings of the International Symposium on Materials for Optoelectronic and Microelectronic Packaging, presented at the third International Ceramic Science and Technology Congress, held in San Francisco, CA, November 1-4, 1992"--T.p. verso
Includes bibliographical references and index |
| シリーズ名 | Ceramic transactions ; v. 33
|
| 分類 | LCC:TK7874
DC20:621.381/046 |
| 件名 | LCSH:Microelectronicpackaging -- Materials
LCSH:Optoelectronicdevices -- Materials
|
| 著者情報 | Ling, Hung C.
Shukla, Vishwa N.
International Symposium on Materials for Optoelectronic and Microelectronic Packaging
International Ceramic Science and Technology Congress
International Ceramic Science and Technology Congress (3rd : 1992 : San Francisco, Calif.)
|
| 和洋区分 | 洋 |
| 標題言語 | 英語 |
| 本文言語 | 英語 |
| 出版国 | アメリカ合衆国 |
| ISBN | 0944904637
|
| 番号 | LCCN : 93011050 |