| NCID | DA08354018 |
| 名称(HDNG) | Components, Packaging & Manufacturing Technology Society |
| から見よ(SF) | CPMT
Components, Packaging, and Manufacturing Technology Society
Institute of Electrical and Electronic Engineers. Components, Packaging & Manufacturing Technology Society
IEEE Components, Packaging, and Manufacturing Technology Society |
| をも見よ(SAF) | IEEE Components, Hybrids, and Manufacturing Technology Society <DA03215284> |
| 注記(NOTE) | Tenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, c1994: t.p. (The Components, Packaging & Manufacturing Technology (CPMT) Society ... one of the 35+ technical groups within the Institute of Electrical and Electronics Engineers) p. iii (Components, Packaging, and Manufacturing Technology Society of IEEE formerly (CHMT))
IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, Feb. 1994: t.p. (IEEE Components, Packaging, and Manufacturing Technology Society) verso t.p. (Components, Packaging, and Manufacturing Technology Society)
IEEE transactions on components, hybrids, and manufacturing technology, Mar. 1978 (a.e.) t.p. (IEEE Components, Hybrids, and Manufacturing Technology Society) verso t.p. (The Components, Hybrids, and Manufacturing Technology Society is an organization within the framework of the IEEE)
SRC:IEEE transactions on components, packaging, and manufacturing technology. Part A(Institute of Electrical and Electronics Engineers, 1994-) |
| LCAID | 94012200 |